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US Patent Issued to Tencent Technology (Shenzhen) on April 7 for "Through silicon via interconnection structure and method of forming same, and quantum computing device" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,967, issued on April 7, was assigned to Tencent Technology (Shenzhen) Co. Ltd. (Shenzhen, China). "Through silicon via interconnection stru... Read More


US Patent Issued to ASM IP Holding on April 7 for "Method of forming patterned structures" (Belgian, Finnish Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,968, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method of forming patterned structures" was invented by... Read More


US Patent Issued to Applied Materials on April 7 for "Flexible monomer for smooth polymer surface" (Singaporean, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,969, issued on April 7, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Flexible monomer for smooth polymer surface" was inv... Read More


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on April 7 for "Top via on subtractively etched conductive line" (New York, Vermont Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,970, issued on April 7, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Top via on subtractively etched conductive l... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Conductive via with improved gap filling performance" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,971, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Conductive via with improved ga... Read More


US Patent Issued to Micron Technology on April 7 for "Methods used in forming a memory array comprising strings of memory cells including insulator walls in a through-array-via region" (Idaho Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,972, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Methods used in forming a memory array comprising strings o... Read More


US Patent Issued to Micron Technology on April 7 for "Microelectronic devices, and related memory devices, electronic systems, and methods" (Idaho Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,973, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices, and related memory devices, electr... Read More


US Patent Issued to XINTEC on April 7 for "Chip package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,974, issued on April 7, was assigned to XINTEC INC. (Taoyuan City, Taiwan). "Chip package and manufacturing method thereof" was invented by... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Integrated circuit device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,975, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device" was invented by J... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,976, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device" was invented by Jeo... Read More